PVD Coating Materials / Sputtering Targets
Titanium Metal Target
Specifications
| Product Name | Titanium Metal Target |
|---|---|
| Product Line | PVD Coating Materials |
| Category | Sputtering Targets |
| Formula / Composition | Ti |
| Purity | ≥99.9% |
| Standard Size | Round Target Dia < 350mm; Rectangular Target Width < 240mm; Rectangular Target Length < 550mm; Tube Target OD < 300mm |
| Packaging | Vacuum packaging |
| Customization | Yes |
Product Features
Prepared from high-purity feedstock under controlled processing for stable and uniform thin-film deposition.
Applications
High-purity titanium sputtering targets are mainly used as TFT metal adhesion underlayers for display panels and ohmic contact buffer layers for semiconductor wafers, improving metal-film adhesion to substrates and preventing oxidation or peeling. They are also widely used for photovoltaic cell buffer films, optical wear-resistant hard coatings, decorative hardware coatings, and MEMS sensor structural coatings.
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