PVD Coating Materials / Sputtering Targets
Tantalum Metal Target
Specifications
| Product Name | Tantalum Metal Target |
|---|---|
| Product Line | PVD Coating Materials |
| Category | Sputtering Targets |
| Formula / Composition | Ta |
| Purity | ≥99.99% |
| Standard Size | Round Target Dia < 350mm; Rectangular Target Width < 240mm; Rectangular Target Length < 550mm |
| Packaging | Vacuum packaging |
| Customization | Yes |
Product Features
Prepared from high-purity feedstock under controlled processing for stable and uniform thin-film deposition.
Applications
High-purity tantalum sputtering targets are primarily used for tantalum nitride diffusion barrier layers in semiconductor copper wiring, and also serve as display TFT metal wiring and storage capacitor electrodes to ensure stable chip and panel processing.
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