PVD Coating Materials / Sputtering Targets
Nickel Vanadium Alloy Target
Specifications
| Product Name | Nickel Vanadium Alloy Target |
|---|---|
| Product Line | PVD Coating Materials |
| Category | Sputtering Targets |
| Formula / Composition | Ni-V |
| Purity | 99.9%~99.99% |
| Standard Size | Round Target Dia < 350mm; Rectangular Target Width < 240mm; Rectangular Target Length < 550mm |
| Packaging | Vacuum packaging |
| Customization | Yes |
Product Features
Prepared from high-purity feedstock under controlled processing for stable and uniform thin-film deposition.
Applications
High-purity nickel-vanadium alloy targets are mainly used as gold-wiring adhesion barrier layers in advanced semiconductor packaging and copper-interconnect diffusion-barrier liners for chips. Their non-magnetic properties suit high-speed magnetron sputtering and simplify wafer coating processes. They are also mainstream materials for 5G RF filter electrodes and display TFT circuit buffer layers, and can be used for precision chip thin-film resistors, photovoltaic electrode barrier films, MEMS sensing layers, and wear-resistant decorative coatings.
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