PVD Coating Materials / Sputtering Targets
Nickel Metal Target
Specifications
| Product Name | Nickel Metal Target |
|---|---|
| Product Line | PVD Coating Materials |
| Category | Sputtering Targets |
| Formula / Composition | Ni |
| Purity | 99.95%~99.99% |
| Standard Size | Round Target Dia < 350mm; Rectangular Target Width < 240mm; Rectangular Target Length < 550mm; Tube Target OD < 300mm |
| Packaging | Vacuum packaging |
| Customization | Yes |
Product Features
Prepared from high-purity feedstock under controlled processing for stable and uniform thin-film deposition.
Applications
High-purity nickel sputtering targets are widely used for bump barrier layers in semiconductor packaging and magnetic films for data storage. They also serve as anti-diffusion buffer layers for display and photovoltaic metal electrodes, helping suppress metal ion migration failures. Additional uses include decorative undercoatings for plastics and hardware, electromagnetic shielding for electronic devices, and corrosion-resistant conductive films for lithium batteries and fuel cells.
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