PVD Coating Materials / Sputtering Targets
Copper Metal Target
Specifications
| Product Name | Copper Metal Target |
|---|---|
| Product Line | PVD Coating Materials |
| Category | Sputtering Targets |
| Formula / Composition | Cu |
| Purity | 99.99%~99.999% |
| Standard Size | Round Target Dia < 350mm; Rectangular Target Width < 240mm; Rectangular Target Length < 550mm; Tube Target OD < 300mm |
| Packaging | Vacuum packaging |
| Customization | Yes |
Product Features
Prepared from high-purity feedstock under controlled processing for stable and uniform thin-film deposition.
Applications
High-purity copper sputtering targets are mainly used for copper interconnects in semiconductor chips, seed layers for advanced packaging, and low-resistance TFT metal wiring in display panels, making them core conductive materials for integrated circuits and high-generation panels. They are also used for photovoltaic conductive films, electromagnetic shielding coatings, flexible circuits, and conductive films for sensor devices.
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